오프로세서

2.5D-type ONC

• Optical Network Chip upgraded from 2.5D Interposer has the optical network on the bottom surface
• A collaborated work between a 2.5D Package company and OPROCESSOR INC. will achieve the goal of optically connected CPU to Marcket.

4 CPUs connected by an optical network chip

Adhesive Technology

• 2.OPROCESSOR INC. has developed the adhesive technology to attach the prism to the surface of the optical waveguide, in which most specifications are experimented and proved, first in the world.

Design and manufacture Microlens

• OPROCESSOR INC. has developed a stand-alone polyimide microlens to make a collimated beam, diameter 30μm, emitted by 50Gbps VCSEL.

LD/PD Module Package Technology

• OPROCESSOR INC. has developed and experimented a small volume, 0.7x0.5x0.65 mm3, of LD/PD modules which can be mounted on a small footprint prism, 0.7x0.5mm2.